ASTM F1512-1994(2003) 溅射目标垫板部件的超声波C扫描粘结评定标准规程
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【英文标准名称】:StandardPracticeforUltrasonicC-ScanBondEvaluationofSputteringTarget-BackingPlateAssemblies
【原文标准名称】:溅射目标垫板部件的超声波C扫描粘结评定标准规程
【标准号】:ASTMF1512-1994(2003)
【标准状态】:现行
【国别】:
【发布日期】:1994
【实施或试行日期】:
【发布单位】:美国材料与试验协会(US-ASTM)
【起草单位】:F01.17
【标准类型】:(Practice)
【标准水平】:()
【中文主题词】:评定;电子材料;无损检验;超声检验;半导体;垫板;胶接;薄膜;实用;垫板部件;扫描粘结;溅射目标;目标;超声波C
【英文主题词】:backingplates;bonding;nondestructivetesting;sputtering;targets;thinfilms;ultrasonictesting
【摘要】:ThispracticesupplementsPracticeE1001byindicatingspecificequipmentchoicesandtestarrangementsappropriateforevaluatingsputteringtargetbonds.Thebondbetweensputteringtargetanditssupportingbackingplateisacriticalreliabilityelementinasputterdepositionsystem.Abondmusthavehighthermalconductivitytoprovideadequatetargetcoolingduringsputtering.Thetarget-backingplatejointmustalsohavestrengthenoughtowithstandtheshearstressescausedbydifferentialthermalexpansionbetweentargetandbackingplate.Flawsinabond,forexample,voidsinthejoiningmaterial,degradebondperformance.Aninadequatebondmayfailinservice,potentiallycausingcatastrophicseparationofthetargetfromthebackingplate.Assuranceofsoundbondsisanimportantconcernamongusersofsputteringequipment.Ultrasonictestingisacceptedasanefficientmethodforevaluatingtargetbonds,butdifferencesintechniqueinhibitintercomparisonofresultsfromonelaboratorytoanother.Thispracticeisintendedtopromoteuniformityinusesothatspecificationsforbondintegritymaybeuniversallyapplied.TheC-spandisplayofultrasonictestdataisadirectmethodforvisuallydemonstratingbondcharacter.PracticeE1001uponwhichthispracticeismodeled,however,doesnotaddressC-scandisplay.InstructionsspecifictotheC-scandisplaymodeareindicatedinthispractice.InotherrespectsthispracticeisasectionbysectioncommentaryonPracticeE1001.1.1Thispracticedescribesamethodforultrasonicmappingofthesoundnessofabondjoiningasputteringtargettoitssupportingbackingplate.Theresultsoftheexaminationmaybeusedinpredictingthetarget-backingplateassembly''ssuitabilityforuse.Accept/rejectstandardsarenotspecified;thesearesubjecttoagreementbetweentargetsupplieranduser,dependingupontheapplicationrequirements.1.2ThisstandardisintendedtobeusedwithPracticeE1001.1.3Themethodrevealsunbondedareas0.125in.(3mm)indiameterandlarger.Thetechniquepermits,forexample,unambiguousquantitativemeasurementofthevoidedareainsolderbonds.1.3.1Thistechniquemayalsoshowregionsinwhichbondintegrityismarginallydegradedbyimperfectadhesion,forexample,areasinwhichoxideinclusionhasinhibitedthedevelopmentoffullbondstrength.Evaluationofindicationsofdegradedbondareasmayvaryinrigorfrompurelysubjectivetosemiquantitative.Targetsupplierandusermustagreeuponthemeansusedtodisplayandgradepartiallybondedareas.1.4Thispracticeisapplicabletoassemblieshavingplanarbondsinwhichthedesignprovidesatleastoneflatplaneparalleltothebondthatmaybeusedastheentry/exitsurfaceforultrasonicexcitation.1.5Onlytheimmersionpulse-echomethodiscovered.1.6Evaluationbythismethodisintendedtobenondestructive.Fortargetassembliesthatwouldbedegradedbyimmersionindemineralizedwater,forexample,forporoustargetmaterials,thetestshouldbeconsideredadestructiveone.1.7Thispracticeisapplicabletobondingmethodsthatuseafillermaterialtojointhetargetandbackingplate.Theseincludesolder,epoxy,andbrazebonds.1.8Thevaluesstatedininch-poundunitsaretoberegardedasthestandard.Thevaluesgiveninparenthesesareforinformationonly.1.9Thisstandarddoesnotpurporttoaddressallofthesafetyconcerns,ifany,associatedwithitsuse.Itistheresponsibilityoftheuserofthisstandardtoestablishappropriatesafetyandhealthpracticesanddeterminetheapplicabilityofregulatorylimitationspriortouse.
【中国标准分类号】:H26
【国际标准分类号】:19_100
【页数】:4P.;A4
【正文语种】:
【原文标准名称】:溅射目标垫板部件的超声波C扫描粘结评定标准规程
【标准号】:ASTMF1512-1994(2003)
【标准状态】:现行
【国别】:
【发布日期】:1994
【实施或试行日期】:
【发布单位】:美国材料与试验协会(US-ASTM)
【起草单位】:F01.17
【标准类型】:(Practice)
【标准水平】:()
【中文主题词】:评定;电子材料;无损检验;超声检验;半导体;垫板;胶接;薄膜;实用;垫板部件;扫描粘结;溅射目标;目标;超声波C
【英文主题词】:backingplates;bonding;nondestructivetesting;sputtering;targets;thinfilms;ultrasonictesting
【摘要】:ThispracticesupplementsPracticeE1001byindicatingspecificequipmentchoicesandtestarrangementsappropriateforevaluatingsputteringtargetbonds.Thebondbetweensputteringtargetanditssupportingbackingplateisacriticalreliabilityelementinasputterdepositionsystem.Abondmusthavehighthermalconductivitytoprovideadequatetargetcoolingduringsputtering.Thetarget-backingplatejointmustalsohavestrengthenoughtowithstandtheshearstressescausedbydifferentialthermalexpansionbetweentargetandbackingplate.Flawsinabond,forexample,voidsinthejoiningmaterial,degradebondperformance.Aninadequatebondmayfailinservice,potentiallycausingcatastrophicseparationofthetargetfromthebackingplate.Assuranceofsoundbondsisanimportantconcernamongusersofsputteringequipment.Ultrasonictestingisacceptedasanefficientmethodforevaluatingtargetbonds,butdifferencesintechniqueinhibitintercomparisonofresultsfromonelaboratorytoanother.Thispracticeisintendedtopromoteuniformityinusesothatspecificationsforbondintegritymaybeuniversallyapplied.TheC-spandisplayofultrasonictestdataisadirectmethodforvisuallydemonstratingbondcharacter.PracticeE1001uponwhichthispracticeismodeled,however,doesnotaddressC-scandisplay.InstructionsspecifictotheC-scandisplaymodeareindicatedinthispractice.InotherrespectsthispracticeisasectionbysectioncommentaryonPracticeE1001.1.1Thispracticedescribesamethodforultrasonicmappingofthesoundnessofabondjoiningasputteringtargettoitssupportingbackingplate.Theresultsoftheexaminationmaybeusedinpredictingthetarget-backingplateassembly''ssuitabilityforuse.Accept/rejectstandardsarenotspecified;thesearesubjecttoagreementbetweentargetsupplieranduser,dependingupontheapplicationrequirements.1.2ThisstandardisintendedtobeusedwithPracticeE1001.1.3Themethodrevealsunbondedareas0.125in.(3mm)indiameterandlarger.Thetechniquepermits,forexample,unambiguousquantitativemeasurementofthevoidedareainsolderbonds.1.3.1Thistechniquemayalsoshowregionsinwhichbondintegrityismarginallydegradedbyimperfectadhesion,forexample,areasinwhichoxideinclusionhasinhibitedthedevelopmentoffullbondstrength.Evaluationofindicationsofdegradedbondareasmayvaryinrigorfrompurelysubjectivetosemiquantitative.Targetsupplierandusermustagreeuponthemeansusedtodisplayandgradepartiallybondedareas.1.4Thispracticeisapplicabletoassemblieshavingplanarbondsinwhichthedesignprovidesatleastoneflatplaneparalleltothebondthatmaybeusedastheentry/exitsurfaceforultrasonicexcitation.1.5Onlytheimmersionpulse-echomethodiscovered.1.6Evaluationbythismethodisintendedtobenondestructive.Fortargetassembliesthatwouldbedegradedbyimmersionindemineralizedwater,forexample,forporoustargetmaterials,thetestshouldbeconsideredadestructiveone.1.7Thispracticeisapplicabletobondingmethodsthatuseafillermaterialtojointhetargetandbackingplate.Theseincludesolder,epoxy,andbrazebonds.1.8Thevaluesstatedininch-poundunitsaretoberegardedasthestandard.Thevaluesgiveninparenthesesareforinformationonly.1.9Thisstandarddoesnotpurporttoaddressallofthesafetyconcerns,ifany,associatedwithitsuse.Itistheresponsibilityoftheuserofthisstandardtoestablishappropriatesafetyandhealthpracticesanddeterminetheapplicabilityofregulatorylimitationspriortouse.
【中国标准分类号】:H26
【国际标准分类号】:19_100
【页数】:4P.;A4
【正文语种】:
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点击此处下载